© THETA Ingenieurbüro GmbH 2015 Thermal Calculations for Electrical Devices   For all those who operate electrical devices and installations, both the reliability and the price of the apparatus are important quality features. The current-carrying capacity and the possible heating resulting from this quantity have a significant influence on these features because the dimensioning of electrical devices depends on the keeping to temperature limits that are laid down by law. Consequently, the dimensioning of the heat dissipation is of great importance. This job should, therefore, be taken on by specialists in measuring and calculating the heating of electrical devices. The usually combined and thus complex electrical- thermal problems are diverse. This implies: a standard solution does not exist (see table). We offer you an efficient engineer´s service in this field. Our strength lies in both the combination of several calculation methods and the experimental verification of the results. By suggesting suitable materials and an optimum geometry for the devices to be developed, we help you to minimise power losses and to improve the heat dissipation. In this way, we help you to construct electrical devices showing a high current-carrying capacity. With our service, we put you into the position to influence and optimise the qualities of your products in a well-directed way. Due to our calculations, you save expenses for developements and tests. Method Thermal Network Method Finite Element Method Advantages Reliable information about convection, coolant circulation and coolant rate Calculation of parallel heat transmission processes Little calculation required Precise calculation of heat conduction Automatic drawing up of the thermal network out of the geometry Disadvantages Complex heat transmission processes cannot be described sufficiently A lot of calculation required, especially at dynamic loads Examples Current-carrying capacity of Kiosk Transformer Stations   Switchgears Development of Fuses  Short-circuit calculations of insulated busbars Comparison of Thermal Network Method and Finite Element Method Return to Overview